{"product_id":"termopasta-gembird-tg-g3-0-01","title":"Thermal paste Gembird TG-G3.0-01","description":"\u003cdiv\u003eGembird TG-G3.0-01 thermal paste is a high-quality thermal compound designed to improve heat transfer between processors and heat sinks. It has a high viscosity and is applied in a thin layer, which allows it to fill all microcracks and deformations, ensuring maximum cooling efficiency. The thermal paste does not crumble, does not leak and is electrically non-conductive, which makes it an ideal choice for use in electronic devices.\u003c\/div\u003e\n\n\n\u003ch2\u003e Characteristics\u003c\/h2\u003e\n\n\u003cul\u003e\n\n\u003cli\u003e Manufacturer: Gembird\u003c\/li\u003e\n\n\u003cli\u003e Manufacturer code: TG-G3.0-01\u003c\/li\u003e\n\n\u003cli\u003e Compatibility: for processors\u003c\/li\u003e\n\n\u003cli\u003e Thermal conductivity: 4.5 W\/mK\u003c\/li\u003e\n\n\u003cli\u003e Weight: 3 g\u003c\/li\u003e\n\n\n\u003c\/ul\u003e","brand":"Gembird","offers":[{"title":"Default Title","offer_id":52233249882428,"sku":"4304^Б","price":193.0,"currency_code":"UAH","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0868\/0462\/7772\/files\/U0114835_main.jpg?v=1734083702","url":"https:\/\/informatica.com.ua\/en\/products\/termopasta-gembird-tg-g3-0-01","provider":"Informatica","version":"1.0","type":"link"}