Thermal paste Gembird TG-G3.0-01

Gembird TG-G3.0-01 thermal paste is a high-quality thermal compound designed to improve heat transfer between processors and heat sinks. It has a high viscosity and is applied in a thin layer, which allows it to fill all microcracks and deformations, ensuring maximum cooling efficiency. The thermal paste does not crumble, does not leak and is electrically non-conductive, which makes it an ideal choice for use in electronic devices.