Thermal pad Gelid Solutions GP-Ultimate Thermal Pad 90x50x1.5 mm (TP-GP04-C)

Gelid Solutions GP-Ultimate thermal pad is designed to effectively dissipate heat from electronic components such as RAM chips, ROMs, chipsets and other integrated circuits. Due to its elasticity and high thermal conductivity, it is ideal for use in industrial electronics.

Characteristics

• Purpose: universal
• Dimensions: 90 x 50 mm
• Thickness: 1.5 mm
• Thermal conductivity: 15 W/mk
• Operating temperature range: -60 °C — 220 °C

Equipment

• 1 pc thermal pad